Process Strategy for Built-in Reliability of Cu Damascene Interconnect System for 0.13μm-Node and Beyond *

Process Strategy for Built-in Reliability of Cu Damascene Interconnect System for 0.13μm-Node and Beyond *

著者名:

Yamaguchi, H.

掲載資料名:

ULSI Process Integration : proceedings of the International Symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2003-6

発行年:

2003

開始ページ:

434

終了ページ:

446

総ページ数:

13

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566773768 [1566773768]

言語:

英語

請求記号:

E23400/200306

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014069
シリーズID:	PA00000028
会議名:	International Symposium on ULSI Process Integration ; Meeting of the Electrochemical Society
回次:	3rd ; 203rd
会議開催地:	Paris, France
会議開催年:	2003.04.28-2003.05.02

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