Proven Extendibility of Low Damage Cu-CMP Process for Sub-0.13 μm ULSI Interconnects
- 著者名:
Tsai, T.C. flu, S.C. Lin, Z.H. Hsu, S.H. Hsu, C.L. Dai, J. Yang, F. Lin, M.H. Chen, H.C. Hsieh, W.Y. - 掲載資料名:
- Copper interconnects, new contact metallurgies, structures, and low-k interlevel dielectrics : proceedings of the internatioal symposium
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 2002-22
- 発行年:
- 2002
- 開始ページ:
- 325
- 終了ページ:
- 330
- 総ページ数:
- 6
- 出版情報:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566773799 [1566773792]
- 言語:
- 英語
- 請求記号:
- E23400/200222
- 資料種別:
- 国際会議録
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9
国際会議録
Trench pattern lithography for 0.13- and 0.10-μm logic devices at 248- and 193-nm wavelengths
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国際会議録
0.13-ヲフm optical lithography for random logic devices using 248-nm attenuated phase-shifting masks
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SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |