Effect of Slurry Dilution and Flow Rate on Coefficient of Friction and Removal Rate for ILD CMP Applications

Effect of Slurry Dilution and Flow Rate on Coefficient of Friction and Removal Rate for ILD CMP Applications

著者名:

掲載資料名:

Chemical Mechanical Planarization : proceedings of the International Symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

2002-1

発行年:

2002

開始ページ:

237

終了ページ:

245

総ページ数:

9

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566773294 [1566773296]

言語:

英語

請求記号:

E23400/2002-1

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00014034
シリーズID:	PA00000028
会議名:	International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing ; Meeting of the Electrochemical Society
回次:	5th ; 201st
会議開催地:	Philadelphia, PA, USA
会議開催年:	2002.05.12-2002.05.17

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