Electrochemistry of Copper in the Chemical Mechanical Planarization (CMP) Slurries Containing Glycine and Hydrogen Peroxide
- 著者名:
- 掲載資料名:
- Chemical Mechanical Planarization : proceedings of the International Symposium
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 2002-1
- 発行年:
- 2002
- 開始ページ:
- 79
- 終了ページ:
- 90
- 総ページ数:
- 12
- 出版情報:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566773294 [1566773296]
- 言語:
- 英語
- 請求記号:
- E23400/2002-1
- 資料種別:
- 国際会議録
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Electrochemical Aspects of Copper Chemical Mechanical Planarization (CMP) in Peroxide Based Slurry
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Effect of Hydrogen Peroxide on Oxidation of Copper in CMP Slurries Containing Glycine and Cu Sulfate
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Fundamental Mechanisms of Copper CMP – Passivation Kinetics of Copper in CMP Slurry Constituents
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