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Fabrication Process and Plasticity of Gold-Gold Thermocompression Bonds

著者名:
掲載資料名:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2001-27
発行年:
2001
開始ページ:
163
終了ページ:
170
総ページ数:
8
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566773607 [1566773601]
言語:
英語
請求記号:
E23400/200127
資料種別:
国際会議録

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