Wafer Bonding Using Low-k Dielectrics aa Bonding Glue in Three-Dimensional Integration
- 著者名:
Kwon, Y. Lu, J.-Q. Gutmann, R.J. Kraft, R.P. McDonald, J. Cale, T.S. - 掲載資料名:
- Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 2001-27
- 発行年:
- 2001
- 開始ページ:
- 145
- 終了ページ:
- 154
- 総ページ数:
- 10
- 出版情報:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566773607 [1566773601]
- 言語:
- 英語
- 請求記号:
- E23400/200127
- 資料種別:
- 国際会議録
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5
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