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Effective Polymer and Etch Residue Removal Using Single-Wafer Processing

著者名:
Peters, D.
Egbe, M.
Ravito, R.
Rieker, J.
Fiener, S.
Tea, T.
Seong, T.-K.
Nguyen, L.V.
Henry, S-A.
Gaulhofer, F.
Haigernioser, C.
DeBear, D.
さらに 7 件
掲載資料名:
Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2000-27
発行年:
2000
開始ページ:
213
終了ページ:
219
総ページ数:
7
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772945 [156677294X]
言語:
英語
請求記号:
E23400/200027
資料種別:
国際会議録

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