Role of Inhibitors in Presence of Oxidizers in Cu-CMP
- 著者名:
Seal, S. Boyd, M. Desai, V. Akesson, I. Easter, W. Guha, A. - 掲載資料名:
- Chemical Mechanical Planarization : proceedings of the International Symposium
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 2000-26
- 発行年:
- 2000
- 開始ページ:
- 288
- 終了ページ:
- 294
- 総ページ数:
- 7
- 出版情報:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772938 [1566772931]
- 言語:
- 英語
- 請求記号:
- E23400/200026
- 資料種別:
- 国際会議録
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12
国際会議録
Copper CMP for Dual Damascene Technology: Some Considerations on the Mechanism of Cu Removal
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