Electrochemical Effects of Various Slurries on the Chemical Mechanical Polishing of Copper-Plated Films
- 著者名:
- 掲載資料名:
- Chemical Mechanical Planarization : proceedings of the International Symposium
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 2000-26
- 発行年:
- 2000
- 開始ページ:
- 180
- 終了ページ:
- 190
- 出版情報:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772938 [1566772931]
- 言語:
- 英語
- 請求記号:
- E23400/200026
- 資料種別:
- 国際会議録
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Analysis of the Tribological Mechanisms Arising in the Chemical Mechanical Polishing of Copper-Film Wafers.
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