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Copper Electrodeposition for On-Chip Interconnection-The Role Of Different Additives

著者名:
掲載資料名:
Electrochemical processing in ULSI fabrication III : proceedings of the international symposium
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
2000-8
発行年:
2000
開始ページ:
85
終了ページ:
102
総ページ数:
18
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772730 [1566772737]
言語:
英語
請求記号:
E23400/2000-8
資料種別:
国際会議録

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