A Few Thoughts on the Alleviation of Dishing and Erosion during Chemical-Mechanical Planarization for Shallow Trench Isolation

A Few Thoughts on the Alleviation of Dishing and Erosion during Chemical-Mechanical Planarization for Shallow Trench Isolation

著者名:

掲載資料名:

Chemical mechanical planariarization in IC device manufacturing III : proceedings of the international symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

99-37

発行年:

1999

開始ページ:

71

終了ページ:

82

総ページ数:

12

出版情報:

Pennington, N. J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772600 [1566772605]

言語:

英語

請求記号:

E23400/99-37

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013965
シリーズID:	PA00000028
会議名:	International Symposium on Chemical Mechanical Planarization ; Meeting of the Electrochemical Society ; Fall Meeting of the Electrochamical Society of Japan
回次:	3rd ; 196th ; 1999
会議開催地:	Honolulu, Hawaii, USA
会議開催年:	1999.10.20-1999.10.22

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