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Why Debonding is Useful in SOI

著者名:
Cha, G.
Lee, S.H.
Park, H.J.
Lee, K.H.
Kang, H.S.
Song, C.S.
Kim, D.J.
Kim, Y.C.
Kim, S.K.
さらに 4 件
掲載資料名:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
99-35
発行年:
1999
開始ページ:
119
終了ページ:
128
総ページ数:
10
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772587 [1566772583]
言語:
英語
請求記号:
E23400/99-35
資料種別:
国際会議録

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