SOI Materials and Device Development at IBM

SOI Materials and Device Development at IBM

著者名:

掲載資料名:

Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

99-35

発行年:

1999

開始ページ:

17

終了ページ:

28

総ページ数:

12

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772587 [1566772583]

言語:

英語

請求記号:

E23400/99-35

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013963
シリーズID:	PA00000028
会議名:	International Symposium on Wafer Bonding ; Fall Meeting of the Electrochemical Society
回次:	5th ; 1999
会議開催地:	Honololu. HI, USA
会議開催年:	1999.10.00

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