A Sequential Copper Plating Process for Multiple Feature Sizes for HDI Applications
- 著者名:
- 掲載資料名:
- Electrochemical technology applications in electronics : proceedings of the third international symposium
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 99-34
- 発行年:
- 1999
- 開始ページ:
- 111
- 終了ページ:
- 119
- 総ページ数:
- 9
- 出版情報:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772570 [1566772575]
- 言語:
- 英語
- 請求記号:
- E23400/99-34
- 資料種別:
- 国際会議録
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