Integration of Electroless and Electrolytic Cu in the IC Back End of Line Technologies*
- 著者名:
Maex, K. Brongersma, S.H. Lantasov, Y. Richard, E. Palmans, R. Vervoort, I. - 掲載資料名:
- Electrochemical technology applications in electronics : proceedings of the third international symposium
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 99-34
- 発行年:
- 1999
- 開始ページ:
- 71
- 終了ページ:
- 79
- 総ページ数:
- 9
- 出版情報:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772570 [1566772575]
- 言語:
- 英語
- 請求記号:
- E23400/99-34
- 資料種別:
- 国際会議録
類似資料:
Trans Tech Publications |
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
3
国際会議録
Influence of Electrochemical Plating Process Parameters on Corrosion of Cu Damascene Interconnects
Materials Research Society |
Materials Research Society |
Materials Research Society |
MRS - Materials Research Society |
Materials Research Society |
Electrochemical Society |
Materials Research Society |
SPIE-The International Society for Optical Engineering |