High-performance Integration of Copper Interconnects with Low-k Hydrogen Silsesquioxane Employing Deuterium Plasma Treatment
- 著者名:
Liu, P.-T. Chang, T.-C. Yang, Y.L. Cheng, Y.F. Lee, J.K. Shih, F.Y. Tsai, E. Chen, G. Sze, S.M. - 掲載資料名:
- Interconnect and contact metallization for ULSI : proceedings of the international symposium
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 99-31
- 発行年:
- 1999
- 開始ページ:
- 251
- 終了ページ:
- 260
- 総ページ数:
- 10
- 出版情報:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772549 [1566772540]
- 言語:
- 英語
- 請求記号:
- E23400/99-31
- 資料種別:
- 国際会議録
類似資料:
1
国際会議録
Ammonia Plasma Passivation Effects on Properties of Post-CMP Low-k Hydrogen Silsesquioxane (HSQ)
Electrochemical Society |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
Materials Research Society |
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
MRS - Materials Research Society |
Electrochemical Society |