Appication of an Electrochemical Copper Metallization-Planarization Process to sub-0.25 um Features

Appication of an Electrochemical Copper Metallization-Planarization Process to sub-0.25 um Features

著者名:

掲載資料名:

Interconnect and contact metallization for ULSI : proceedings of the international symposium

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

99-31

発行年:

1999

開始ページ:

152

終了ページ:

161

総ページ数:

10

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772549 [1566772540]

言語:

英語

請求記号:

E23400/99-31

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013959
シリーズID:	PA00000028
会議名:	International symposium on interconnect and contact metallization for ULSI
回次:	1999
会議開催地:	Honolulu, HI, USA
会議開催年:	1999.10.17-1999.10.22

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