The Use of Copper Based Backmetai Schemes As a Low Stress and Low Thermal Resistance Alternative for Use in Thin Substrate Power Devices
- 著者名:
- 掲載資料名:
- Electrochemical processing in ULSI fabrication and semiconductor/metal deposition II : proceedings of the international symposium
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 99-9
- 発行年:
- 1999
- 開始ページ:
- 185
- 終了ページ:
- 193
- 総ページ数:
- 9
- 出版情報:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772310 [1566772311]
- 言語:
- 英語
- 請求記号:
- E23400/99-9
- 資料種別:
- 国際会議録
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