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Cure Kinetics of Advanced Flip-Chip Underfill Materials

著者名:
Hsu, D.I.
Kim, H.K.
Shi, F.G.
Chungpaiboonpatana, S.
Davidson, C.
Adams, J.M.
さらに 1 件
掲載資料名:
Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues, proceedings of the fourth International Symposium and Thin Film Materials for Advanced Packaging Technologies : proceedings of the second International Symposium
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
99-7
発行年:
1999
開始ページ:
209
終了ページ:
226
出版情報:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772297 [156677229X]
言語:
英語
請求記号:
E23400/99-7
資料種別:
国際会議録

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