Thermal Stability of Electrodeposited Copper Interconnect with Low-K Films
- 著者名:
Lee, S. Lee, K.-W. Yang, S.-H. Kim, Y.-A. Oh, K. Park, J.-W. - 掲載資料名:
- Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues, proceedings of the fourth International Symposium and Thin Film Materials for Advanced Packaging Technologies : proceedings of the second International Symposium
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 99-7
- 発行年:
- 1999
- 開始ページ:
- 69
- 終了ページ:
- 78
- 総ページ数:
- 10
- 出版情報:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772297 [156677229X]
- 言語:
- 英語
- 請求記号:
- E23400/99-7
- 資料種別:
- 国際会議録
類似資料:
Materials Research Society |
7
国際会議録
In Situ HREM Study on the Thermal Stability of Atomic Layer Epitaxy Grown InAs/GaAs Quantum Dots
Materials Research Society |
Trans Tech Publications |
8
国際会議録
Evolution of Surface Morphologies in Sputtered and Electroplated Cu Films during Thermal Cycling
Trans Tech Publications |
MRS-Materials Research Society |
Materials Research Society |
Electrochemical Society |
Electrochemical Society |
SPIE - The International Society of Optical Engineering |
Electrochemical Society |
SPIE - The International Society for Optical Engineering |
Trans Tech Publications |