Inhibition of Alumina Particle Deposition onto Silicon Dioxide Surfaces during Tungsten CMP through the Use of Citric Acid

Inhibition of Alumina Particle Deposition onto Silicon Dioxide Surfaces during Tungsten CMP through the Use of Citric Acid

著者名:

掲載資料名:

Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

98-7

発行年:

1998

開始ページ:

161

終了ページ:

172

出版情報:

Pennington, N. J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772013 [156677201X]

言語:

英語

請求記号:

E23400/98-7

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013910
シリーズID:	PA00000028
会議名:	International Symposium on Chemical Mechanical Planarization ; Annual Meeting of Electrochemical Society
回次:	2nd ; 193rd
会議開催地:	San Diego, CA, USA
会議開催年:	1998.05.05-1998.05.07

類似資料:

1 国際会議録 Use of Malonic Acid in Chemical Mechanical Polishing (CMP) of Tungsten Zhang, L., Raghavan, S. MRS - Materials Research Society	7 国際会議録 SURFACE ENERGETICS IN THE ADSORPTION OF HYDROCHLORIC ACID ONTO TRANSITION ALUMINAS Fleming, Hubert L. American Institute of Chemical Engineers
2 国際会議録 ASPECTS OF ALUMINA PARTICLE DEPOSITION ONTO CVD TUNGSTEN WAFERS RELEVANT TO POST CMP CLEANING Jeon, Joong S., Raghunath, Chilkunda, Kneer, Emil A., Raghavan, Srini Electrochemical Society	8 国際会議録 Treatment of Alumina and Silica CMP Waste by Electrodecantation and Electrocoagulation Belongia, B.M., Haworth, P.D., Baygents, J.C., Raghavan, S. Electrochemical Society
3 国際会議録 Electrochemical Investigations during the Abrasion of Aluminum Thin Films in an lodate Based Alumina Slurry Fang, Yan, Raghavan, Srini, Sabde, Gundu, Meikle, Scott Electrochemical Society	9 国際会議録 Mechanistic Aspects of Chemical Mechanical Polishing of Tungsten Using Ferric Ion Based Alumina Slurries Raghunath, C., Lee, K.T., Kneer, E.A., Mathew, V., Raghavan, S. Electrochemical Society
4 国際会議録 Electroless Deposition of CuNiP Alloys onto Silicon Surfaces F. T. Parra, S. G. dos Santos Filho, A. E. Marques, S. Martini Electrochemical Society	10 国際会議録 THE EFFECTS OF SURFACE TREATMENT FOR LOW TEMPERATURE SILICON DIOXIDE DEPOSITION ON CADMIUM TELLURIDE Choi, Seong S., Kim, S.S., Tsu, D.V., Lucovsky, G. Materials Research Society
5 国際会議録 The Adsorption Behaviors of Citric Acid on Abrasive Particles in Cu CMP Slurry Kang, Young-Jae, Hong, Yi-Koan, Song, Jae-Hoon, Kim, In-Kwon, Park, Jin-Goo Materials Research Society	11 国際会議録 Cu Particles Deposition onto MWCNTs by Chemical Reaction G.S. Cho, J.K. Lim, H. Jang, K.H. Choe, W. Lee Trans Tech Publications
6 国際会議録 Particle Deposition Onto Chemically and Topologically Heterogeneous Surfaces Jeffrey A.L. Kemps, Subir Bhattacharjee American Institute of Chemical Engineers	12 国際会議録 Electrochemical and Frictional Behaviors of Cu Surface in Organic Acid Based Slurries During Copper CMP Eom, D.-H., Ryu, J.-S., Hong, Y.-K., Myung, J.-J., Kim, K.-S., Park, J.-G. Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12