A Cautious Approach to the Removal of Ta in the CMP Polishing of Cu-Ta Structures

A Cautious Approach to the Removal of Ta in the CMP Polishing of Cu-Ta Structures

著者名:

掲載資料名:

Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

98-7

発行年:

1998

開始ページ:

119

終了ページ:

125

出版情報:

Pennington, N. J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772013 [156677201X]

言語:

英語

請求記号:

E23400/98-7

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013910
シリーズID:	PA00000028
会議名:	International Symposium on Chemical Mechanical Planarization ; Annual Meeting of Electrochemical Society
回次:	2nd ; 193rd
会議開催地:	San Diego, CA, USA
会議開催年:	1998.05.05-1998.05.07

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