Modeling of Electromigration-Induced Failure of Metallic Thin Films Interconnects

Modeling of Electromigration-Induced Failure of Metallic Thin Films Interconnects

著者名:

掲載資料名:

Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I and Interconnect and Contact Metallization: materials, processes, and reliability

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

98-6

発行年:

1998

開始ページ:

232

終了ページ:

243

総ページ数:

12

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772006 [1566772001]

言語:

英語

請求記号:

E23400/98-6

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013909
シリーズID:	PA00000028
会議名:	Symposia on Electrochemical Processing in ULSI Fabrication ; Meeting of the Electrochemical Society ; Interconnect and Contact Metallization: Materials, Processes, and Reliability ; Meeting of the Electrochemical Society
回次:	1st ; 193rd ; 1998 ; 194th
会議開催地:	San Diego, CA, USA ; San Diego, CA, USA ; Boston, MA, USA ; Boston, MA, USA
会議開催年:	1998.05.04-1998.05.05 ; 1998.05.04-1998.05.05 ; 1998.11.01-1998.11.06 ; 1998.11.01-1998.11.06

類似資料:

1 国際会議録 Modelling of Failure in Metallic Thin Films Induced By Stress and Electromigration: A Multiscale Computational Analysis Gungor, M. R., Gray, L. J., Zhou, S. J., Maroudas, D. MRS - Materials Research Society	7 国際会議録 Theoretical Analysis of Faceted Void Dynamics in Metallic Thin Films Under Electromigration Conditions Ho, Henry S., Gungor, M. Rauf, Maroudas, Dimitrios MRS - Materials Research Society
2 国際会議録 Analysis of Failure in Metallic Thin-Film Interconnects Due to Stress and Electromigration-Induced Void Propagation Gungor, M. Rauf, Gray, Leonard J., Maroudas, Dimitrios MRS - Materials Research Society	8 国際会議録 Analysis of Electromigration-Driven Interactions between Voids in Metallic Thin Films Jaeseol Cho, M. Rauf Gungor, Dimitrios Maroudas American Institute of Chemical Engineers
3 国際会議録 Theoretical Analysis of Electromigration-Induced Failure of Metallic Thin Films Maroudas, Dimitrios, Gungor, M. Rauf, Ho, Henry S., Enmark, Matthew N. MRS - Materials Research Society	9 国際会議録 564c. Effects of Elastic Stress on Electromigration-Driven Void Dynamics in Metallic Thin Films M. Rauf Gungor, Vivek Tomar, Dimitrios Maroudas American Institute of Chemical Engineers
4 国際会議録 Thermal Processing and Failure Due to Current Driven Mass Transport of Metallic Thin Film Interconnects Gray, Leonard J., Gungor, Rauf, Maroudas, Dimitrios American Institute of Chemical Engineers	10 国際会議録 Atomic-Scale Analysis of Strain Relaxation Mechanisms in Ultra-Thin Metallic Films Rauf Gungor, M., Maroudas, Dimitrios Materials Research Society
5 国際会議録 Analysis of Electromigration-Induced Void Motion and Surface Oscillation in Metallic Thin-Film Interconnects Cho, Jaeseol, Gungor, M. Rauf, Maroudas, Dimitrios Materials Research Society	11 国際会議録 512a. Atomic-Scale Analysis of Ductile Void Growth and Nanocrystalline Domain Formation as Strain Relaxation Mechanisms in Ultra-Thin Metallic Films M. Rauf Gungor, Dimitrios Maroudas American Institute of Chemical Engineers
6 国際会議録 177a. Non-Linear Analysis of Electromigration-Induced Surface Waves on Voids in Metallic Thin Films Jaeseol Cho, M. Rauf Gungor, Dimitrios Maroudas American Institute of Chemical Engineers	12 国際会議録 (370f) Electromigration-Driven Surface Morphological Stabilization of a Coherently Strained Heteroepitaxial Thin Film Georgios I. Sfyris, Rauf M. Gungor, Dimitrios Maroudas American Institute of Chemical Engineers

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