Wafer Bonding of GaAs, InP, and Si Annealed without Hydrogen for Advanced Device Technologies
- 著者名:
Roberds, B.E. Choquette, K.D. Geib, K.M. Kravitz, S.H. Twesten, R.D. Farrens, S.N. - 掲載資料名:
- Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications
- シリーズ名:
- Electrochemical Society Proceedings Series
- シリーズ巻号:
- 97-36
- 発行年:
- 1997
- 開始ページ:
- 592
- 終了ページ:
- 597
- 出版情報:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566771894 [1566771897]
- 言語:
- 英語
- 請求記号:
- E23400/97-36
- 資料種別:
- 国際会議録
類似資料:
Electrochemical Society |
SPIE - The International Society for Optical Engineering |
Electrochemical Society |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
SPIE - The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
12
国際会議録
High-performance vertical-cavity laser,driver,and receiver arrays for optical interconnects
SPIE - The International Society for Optical Engineering |