Interchip Via Technology-Three Dimensional Metallization for Vertically Integrated Circuits

Interchip Via Technology-Three Dimensional Metallization for Vertically Integrated Circuits

著者名:

掲載資料名:

Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

97-36

発行年:

1997

開始ページ:

509

終了ページ:

520

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566771894 [1566771897]

言語:

英語

請求記号:

E23400/97-36

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013898
シリーズID:	PA00000028
会議名:	International Symposium on Semiconductor Wafer Bonding
回次:	4th
会議開催地:	Paris, France
会議開催年:	1997.00.00

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