Blank Cover Image

Electrostatic Bonding for Silicon on Glass Applications

著者名:
Baine, P.T.
Quinn, L.J.
Lee, B.
Mitchell, S.J.N.
Gamble, H.S.
Armstrong, B.M.
さらに 1 件
掲載資料名:
Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
97-36
発行年:
1997
開始ページ:
214
終了ページ:
221
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771894 [1566771897]
言語:
英語
請求記号:
E23400/97-36
資料種別:
国際会議録

類似資料:

1 国際会議録 Germanium Bonding to AL2O3

P.T. Baine, H. Gamble, B. Armstrong, S.J.N. Mitchell, D. McNeill

Electrochemical Society
7 国際会議録 Silicon Wafer Direct Bonding for Smart-Cut SOI with Buried Tungsten Silicide Layer

Suder, S.L., Hurley, R., Li, F.X., Bain, M., Baine, P., MeNeill, D.W., Armstrong, B.M., Gamble, H.S.

Electrochemical Society
2 国際会議録 Investigation of the Role of Chemical-Mechanical Polishing in Improving the Performance of Polysilicon TFTs

Armstrong, B. M., Baine, P. T., Gamble, H. S., Lee, B., Mitchell, S. J. N., Quinn, L. J.

Materials Research Society
8 国際会議録 Fabrication and characterisation of Silicon On Insulator substrates incorporating thermal vias.

Bain, M.F., Baine, P., McNeill, D.W., Srinivasan, G., Jankovic, N., McCartney, J., Moore, R.A., Armstrong, B.M., Gamble, …

Kluwer Academic Publishers
3 国際会議録 Production of silicon diaphragms by precision grinding

Prochaska,A., Baine,P.T., Mitchell,S.J.N., Gamble,H.S.

SPIE-The International Society for Optical Engineering
9 国際会議録 Buried Metallic Layer with Silicon Direct Bonding

Goh, W.L., Campbell, D.L., Armstrong, B.M., Gamble, H.S.

Electrochemical Society
4 国際会議録 SOI Production using Polish Stops Formed by Trench before Bond Techniques

Gay, D.L., Baine, P.T., Armstrong, B.M., Gamble, H.S.

Electrochemical Society
10 国際会議録 SPICE modeling of liquid capacitance in micromachined silicon capillaries

Rainey,P.V., Mitchell,S.J.N., Gamble,H.S.

SPIE-The International Society for Optical Engineering
5 国際会議録 Back Gate Effects in N-Channel Monocrystalline Silicon Devices-on-Glass and Their Suppression by Boron Ion Implantation

Armstrong, B. M., Baine, P., Gamble, H. S., Mitchell, S. J. N.

Materials Research Society
11 国際会議録 Coplanar waveguides on SOI and OPS substrates

Gamble,H.S., Leong,K.O., Raza,S.H., Armstrong,B.M., Mitchell,S.J.N., Yang,S., Fusco,V.F., Stewart,J.A.C.

SPIE-The International Society for Optical Engineering
6 国際会議録 Low Temperature Bonding of PECVD Silicon Dioxide Layers

P.T. Baine, M. Bain, D.W. McNeill, H.S. Gamble, M. Armstrong

Electrochemical Society
12 国際会議録 Investigation of the Electrical Properties of Bonded Silicon-on-Isolator Wafers

Bailey, P.T, Jin, G., Armstrong, B.M., Gamble, H.S.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12