Copper Dissolution and Chemical-Mechanical Polishing in Acidic Media

Copper Dissolution and Chemical-Mechanical Polishing in Acidic Media

著者名:

掲載資料名:

Proceedings of the Symposium on Interconnect and Contact Metallization

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

97-31

発行年:

1997

開始ページ:

73

終了ページ:

83

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566771849 [1566771846]

言語:

英語

請求記号:

E23400/97-31

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013893
シリーズID:	PA00000028
会議名:	Symposium on Interconnect and Contact Metallization ; Fall Meeing of the Electrochemical Society
回次:	1997 ; 1997
会議開催地:	Paris, France
会議開催年:	1997.08.31-1997.09.05.

類似資料:

1 国際会議録 Role of Chemicals and Abrasive Particle Properties in Chemical-Mechanical Polishing of Copper and Tantalum Li, Y., Jindal, A., Babu, S.V. Electrochemical Society	7 国際会議録 Crystalline Anisotropy in Copper Dissolution in Acid Chloride Media Wu, Q., Barkey, D.P. Electrochemical Society
2 国際会議録 Effect of pH on Chemical-Mechanical Polishing of Copper and Tantalum Jindal, Anurag, Li, Ying, Babu, S.V. Materials Research Society	8 国際会議録 Characterization of the Chemical Interactions on Copper Chemical Mechanical Polishing Lee, S.-M., Abiade, J., Choi, W., Singh, R. Electrochemical Society
3 国際会議録 Novel Use of Surfactants in Copper Chemical Mechanical Polishing (CMP) Hong, Youngki, Patri, Udaya B., Ramakrishnan, Suresh, Babu, S.V. Materials Research Society	9 国際会議録 Slurry Retention and Transport During Chemical-Mechanical Polishing of Copper Jindal, Anurag, Li, Ying, Narayanan, Satish, Bobu, S.V. Materials Research Society
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5 国際会議録 Electrochemical Interaction Between Copper and Barrier Materials Using Chemical Mechanical Polishing Evans, D.R. Electrochemical Society	11 国際会議録 The Chemical-Mechanical Polishing of Copper with Model Slurries Lee, B-C., Duquette, D.J., Gutmann, R.J. Electrochemical Society
6 国際会議録 Electrochemical Studies of Copper Chemical Mechanical Polishing Mechanism: Effects of Oxidizer Concentration Lu, J., Garland, J. E., Petite, C. M., Babu, S. V., Roy, D. Materials Research Society	12 国際会議録 586e. Characterization of Copper Chemical Mechanical Polishing in Nitric Acid Slurries Moganty Surya Sekhar, S. Ramanathan American Institute of Chemical Engineers

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