Using Variation Decomposition Analysis to Determine the Effect of Process on Wafer- and Die-Level Uniformity in Oxide CMP

Using Variation Decomposition Analysis to Determine the Effect of Process on Wafer- and Die-Level Uniformity in Oxide CMP

著者名:

Ouma, D.

掲載資料名:

Proceedings of the First International Symposium on Chemical Mechanical Planarization

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

96-22

発行年:

1996

開始ページ:

164

終了ページ:

175

総ページ数:

12

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566771726 [1566771722]

言語:

英語

請求記号:

E23400/970318

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013855
シリーズID:	PA00000028
会議名:	International Symposium on Chemical Mechanical Planarization ; Meeting of the Electrochemical Society
回次:	1st ; 190th
会議開催地:	San Antonio, Texas, USA
会議開催年:	1996.10.06-1996.10.11

類似資料:

1 国際会議録 Wafer-scale modeling of pattern effect in oxide chemical mechanical polishing Ouma,D., Stine,B., Divecha,R., Boning,D., Chung,J., Shinn,G.B., Ali,I., Clark,J. SPIE-The International Society for Optical Engineering	7 国際会議録 Inter-and intra-die polysilicon critical dimension variation Stine,B.E., Boning,D.S., Chung,J.E., Bell,D.A., Equi,E. SPIE-The International Society for Optical Engineering
2 国際会議録 Spatial Variation in Semiconductor Processes: Modeling for Control Boning, D., Chung, J., Ouma, D., Divecha, R. Electrochemical Society	8 国際会議録 Analysis of solvent effect to control the BARC coating uniformity Jung, M.-H., Yoon, S., Chung, E.-S., Yoo, B.-S., Ya, J.Y., Winning, D., Kim, B.D., Lee, H., Kim, D.Y., Kim, Y.H., Kim, … SPIE - The International Society of Optical Engineering
3 国際会議録 Evaluation of pad life in chemical mechanical polishing process using statistical metrology Muthukrishnan,N.M., Prasad,S., Stine,B.E., Loh,W., Nagahara,R., Chung,J.E., Boning,D.S. SPIE-The International Society for Optical Engineering	9 国際会議録 Non-contact Post-CMP Cleaning Using a Single Wafer Processing System Olesen, M.B., Fraser, B., Franklin, C., Bran, M. Electrochemical Society
4 国際会議録 A Predictive Model for Controlling Wafer Level Polish Rate Uniformity in Oxide CMP Merchant, Tushar P., Borucki, Leonard J., Lawing, A. Scott, Banerjee, Suman K., Zabasajja, John N. Materials Research Society	10 国際会議録 Chemical Mechanical Planarization (CMP) Process Windows in Shallow Trench Isolation for Advanced CMOS Chaterjee, A., Kwok, S.P., Ali, I., Joyner, K., Shinn, G., Sheng, I.-C. Electrochemical Society
5 国際会議録 Using Wafer-Scale Patterns for CMP Analysis Lee, B., Gan, T., Boning, D.S., David, J., Bonner, B.A., McKeever, P., Osterheld, T.H. Materials Research Society	11 国際会議録 Post Copper CMP Cleaning: A Non-Contact Megasonic Method Eissa, M., Joshi, S., Shinn, G., Rafie, S., Fraser, B. Electrochemical Society
6 国際会議録 IC yield prediction and analysis using semi-empirical yield models and test data Ciplickas, D.J., Niewczas, M., Ruehl, R., Stine, B., Vallishayee, R.R., Wojciak, W. SPIE-The International Society for Optical Engineering	12 国際会議録 Effect of Wafer Temperature on Highly Selective Oxide Etch Process Using Freon Based Chemistry Qiao, J., Thekdi, S., Branco, W.G., Jin, B., Shamble, E.M. Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12