Blank Cover Image

12 A Unique Electrodeposition Process of a Lead-Free-Solder - Pure Tin

著者名:
掲載資料名:
Proceedings of the Symposium on Environmental Aspects of Electrochemical Technology: applications in electronics
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
96-21
発行年:
1996
開始ページ:
159
終了ページ:
176
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771719 [1566771714]
言語:
英語
請求記号:
E23400/970283
資料種別:
国際会議録

類似資料:

1 国際会議録 Immersion Plating of Bismuth on Tin-Based Alloys to Stabilize Lead-Free Solders

Cooper, E.I., Goldsmith, C.C., Mojica, C., Kilpatrick, S.J., Alley, R.J.

Electrochemical Society
7 国際会議録 Flip-Chip Metallurgies for Lead-Free Solders

Korhonen, T. M., Hong, S. J., Korhonen, M. A., Li, C.-Y.

MRS - Materials Research Society
2 国際会議録 Electrodeposition of lead-tin alloys

Sheppard, K.G., Lin, Q.

Electrochemical Society
8 国際会議録 Reliability Assessment of Lead Free Soldered PWBs

I.J. Cho, K.S. Chae, S.T. Kim, O. Wittler, Y.E. Shin

Trans Tech Publications
3 国際会議録 Electrocodeposition of Silver Particles with Tin for Fabrication of Lead-Free Solder Bumps

D.P. Barkey, B. Wu, A. Keigler, Z. Liu

Electrochemical Society
9 国際会議録 Lead Free Solders for Area Array Packaging

Jung,E., Kloeser,J., Aschenbrenner,R., Reichl,H., Kallmayer,Ch., Coskina,P.

IMAPS
4 国際会議録 Spreading Dynamics of Tin, Bismuth and Some Lead-Free Solders over Copper Substrate

Shang, X., Mazur Lauricella, C., Brandi, S. D.

Trans Tech Publications
10 国際会議録 Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging

Jeong, S.W., Kim, J.H., Lee, H.M.

Trans Tech Publications
5 国際会議録 Development of high-speed laser soldering process for lead-free solder with diode laser

Wang, J., Watanabe, M., Goto, Y., Fujii, K., Kuriaki, H., Satoh, M., Ikeda, J., Fujimoto, K.

SPIE-The International Society for Optical Engineering
11 国際会議録 Tin (Sn) Recovery from Wave Soldering Lead Free Solder Dross via Hydrochloric Acid Leaching and Combustion Treatment

S.A. Ismail, N.H. Jamil, K. Hussin, M.A.A. Mohd Salleh

Trans Tech Publications
6 国際会議録 Controlling Whisker Formation in Tin-Based Solders Using Electrically Mediated Electrodeposition

H. Garich, H. McCrabb, E.J. Taylor, M. Inman

Electrochemical Society
12 国際会議録 PHASE STABILITY AND MECHANICAL BEHAVIOR OF TERNARY BISMUTH-LEAD-TIN SOLDERS

Whealon, W.J., Stone, D.S., Chang, Y.A.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12