Conformal Electroless Copper Deposition for sub-0.5 μm Interconnect Wiring of Very High Aspect Ratio

Conformal Electroless Copper Deposition for sub-0.5 μm Interconnect Wiring of Very High Aspect Ratio

著者名:

Lopatin, S.

掲載資料名:

Proceedings of the Third Symposium on Electrochemically Deposited Thin Films

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

96-19

発行年:

1996

開始ページ:

271

終了ページ:

288

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566771696 [1566771692]

言語:

英語

請求記号:

E23400/970102

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013853
シリーズID:	PA00000028
会議名:	Symposium on Electrochemically Deposited Thin Films ; Fall Meeting of the Electrochemical Society
回次:	3rd ; 1996
会議開催地:	San Antonio, Texas, USA
会議開催年:	1996.10.06-1996.10.11

類似資料:

1 国際会議録 Electroless CoWP Barrier/Protection Layer Deposition for Cu Metallization Lopatin, S., Shacham-Diamand, Y., Dubin, V., Vasudev, P. K., Pellerin, J., Zhao, B. MRS - Materials Research Society	7 国際会議録 Sub-Half Micron Electroless Cu Metallization Dubin, V. M., Shacham-Diamand, Y., Zhao, B., Vasudev, P. K., Ting, C. H. MRS - Materials Research Society
2 国際会議録 Electroless Cu and barrier layers for subhalf-micron multilevel interconnects Lopatin,S., Shacham-Diamand,Y., Dubin,V., Vasudev,P.K. SPIE-The International Society for Optical Engineering	8 国際会議録 Integration of Electroless Cu and CoWP Multilayers in Damascene Process Lopatin, S., Shacham-Diamand, Y., Dubjn, V., Vasudev, P.K. Electrochemical Society
3 国際会議録 Thin electroless barrier for copper films Lopatin,S.D., Shacham-Diamand,Y.Y., Dubin,V.M., Kim,Y.S., Vasudev,P.K. SPIE-The International Society for Optical Engineering	9 国際会議録 Electrochemical and Material Study of Electroless Ternary Barriers for Copper Interconnects Lopatin, S., Kim, Y., Shacham-Diamand, Y. MRS - Materials Research Society
4 国際会議録 Interaction between the Electroless Copper Deposition Solution and the Low-k Fluorinated Dielectrics Hsu, D.T., Tong, H.Y., Shi, F.G., Lopatin, S., Shacham-Diamand, Y., Zhao, B., Brongo, M., Vasudev, P.K. Electrochemical Society	10 国際会議録 Self-Aligned Interconnects Made by Electroless Deposition of Copper on Tungsten M. Angyal, Y. Shacham-Diamand, C. Mak, B. Miller, L. Feldman Electrochemical Society
5 国際会議録 Compatibility of Low Dielectric Constant Poly (arylether) with the Electroless Copper Deposition Solution Hsu, D., Iskander, M., Tong, H.Y., Shi, F., Lopatin, S., Shacham-Diamand, Y., Zhao, B., Brongo, M., Vasudev, P.K. Electrochemical Society	11 国際会議録 Conformal Electroless Copper and Nickel Deposition on MEMS Structures Adams, S.G., Kudrle, T.D., MacDonald, N.C., Neves, H.P., Chen, J-M., Lopatin, S., Maharbiz, M. Materials Research Society
6 国際会議録 Extendibility of Eiectrochemicai Deposition for High Aspect Ratio Copper Interconnects Lopatin, Sergey Electrochemical Society	12 国際会議録 Very High Aspect Ratio Deep Trench Structures for Sub-0.13 μm DRAMs Ranade, R., Mathad, G.S. Electrochemical Society

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