Blank Cover Image

Wafer-level scale package of MEMS device by eutectic bonding method

著者名:
Chen, S. ( Huazhong Univ. of Science and Technology (China) )
Ma, H. ( Huazhong Univ. of Science and Technology (China) )
Chen, M. ( Huazhong Univ. of Science and Technology (China) )
Xiong, T. ( Huazhong Univ. of Science and Technology (China) )
Liu, S. ( Huazhong Univ. of Science and Technology (China) )
Yi, X. ( Huazhong Univ. of Science and Technology (China) )
さらに 1 件
掲載資料名:
Reliability, Testing, and Characterization of MEMS/MOEMS III
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
5343
発行年:
2004
開始ページ:
94
終了ページ:
100
総ページ数:
7
出版情報:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819452511 [0819452513]
言語:
英語
請求記号:
P63600/5343
資料種別:
国際会議録

類似資料:

1 テクニカルペーパー Wafer- Level MEMS Package by Gold- Tin Bonding Method.

Chen, S., Liu, S., Chen, M., Xiong, T., Zhang, D.

American Society of Mechanical Engineers
7 国際会議録 Bump-less Wafer Level Bonding Experiment for Vertical Integration MEMS Device

M. Moriguchi, M. Shiozaki, S. Sasaki, M. Oba

Electrochemical Society
2 国際会議録 Wafer Scale Packaging of MEMS by Using Plasma Activated Wafer Bonding

Suni, T., Henttinen, K., Lipsainen, A., Dekker, J., Luoto, H., Kulawski, M.

Electrochemical Society
8 国際会議録 Room Temperature, Adhesive Bonding for Wafer Scale Packaging of Fluidic Microsystems

Ma, X., Gierhart, B., Collins, S.D., Smith, R.L.

Electrochemical Society
3 国際会議録 Novel method of fabrication of diffractive microlens arrays

Chen, S., Yi, X., Ma, H., Huang, G., Wang, H., Xiong, T., Li, X.

SPIE-The International Society for Optical Engineering
9 国際会議録 Wafer Bonding for Optical MEMS

Bakke, T., Volker, B., Schenk, H., Radu, I., Reiche, M.

Electrochemical Society
4 国際会議録 Laser-Assisted Selective Bonding for Wafer-Level & Chip-Scale Vacuum Packaging of MEMS and Related Micro Systems

Tao, Yi, Malshe, Ajay P., Brown, W.D.

IMAPS
10 国際会議録 Selective Au-Si Eutectic Bonding for Si-Based MEMS Applications

Lee, A.P., Lehew, S., Yu, C., Ciarlo, D.R., Northrup, M.A., Schmit, E.

Electrochemical Society
5 国際会議録 Wafer lever packaging for gyroscope by Au/Si eutectic bonding

Ruan, Y., Zhang, D.C., Yang, Z.C., Wang, X., Yu, X.M.

SPIE-The International Society for Optical Engineering
11 国際会議録 Bonding and Contacting of MEMS-Structures on Wafer Level

Wiemer, M., Fromel, J., Jia, C., Gessner, T.

Electrochemical Society
6 国際会議録 Wafer level optoelectronic device packaging using MEMS (Invited Paper)

Nallani, A., Chen, T., Lee, J.-B., Hayes, D., Wallace, D.

SPIE - The International Society of Optical Engineering
12 国際会議録 Wafer scale packaging for a MEMS video scanner

Helsel,M.P., Barger,J.D., Wine,D.W., Osborn,T.D.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12