Nano-particle laser removal from silicon wafers
- 著者名:
- Lee, J.M. ( Innovative Laser Technology (USA) )
- Cho, S.H. ( Innovative Laser Technology (USA) )
- Kim, T.H. ( Innovative Laser Technology (USA) )
- Park, J.-G. ( Hanyang Univ. (South Korea) )
- Busnaina, A.A. ( Northeastern Univ. (USA) )
- 掲載資料名:
- Fourth International Symposium on Laser Precision Microfabrication : 21-24 June, 2003, Munich, Germany
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 5063
- 発行年:
- 2003
- 開始ページ:
- 441
- 終了ページ:
- 444
- 総ページ数:
- 4
- 出版情報:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819448699 [0819448699]
- 言語:
- 英語
- 請求記号:
- P63600/5063
- 資料種別:
- 国際会議録
類似資料:
1
国際会議録
Laser-induced shock wave removal of chemical-mechanical polishing slurries from silicon wafers
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
SPIE - The International Society for Optical Engineering | |
Electrochemical Society |
SPIE - The International Society of Optical Engineering |