Deposition of Copper Thin Films on Titanium Nitride Layer Prepared by Flow Modulation CVD Technology

Deposition of Copper Thin Films on Titanium Nitride Layer Prepared by Flow Modulation CVD Technology

著者名:

Cho, N.I.

掲載資料名:

Designing, processing and properties of advanced engineering materials : proceedings of the 3rd International Symposium on Designing, Processing and Properties of Advanced Engineering Materials, held in Jeju, Korea, November 5-8, 2003

シリーズ名:

Materials science forum

シリーズ巻号:

449-452

発行年:

2004

開始ページ:

457

終了ページ:

460

総ページ数:

4

出版情報:

Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499397 [0878499393]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013359
シリーズID:	PA00000012
会議名:	International Symposium on Designing, Processing and Properties of Advanced Engineering Materials
回次:	3rd
会議開催地:	Jeju, Korea
会議開催年:	2003.11.05-2003.11.08

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