Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging

Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging

著者名:

掲載資料名:

THERMEC '2003 : International Conference on Processing & Manufacturing of Advanced Materials, July 7-11, 2003, Leganés, Madrid, Spain

シリーズ名:

Materials science forum

シリーズ巻号:

426-432

発行年:

2003

パート:

5

開始ページ:

4081

終了ページ:

4086

総ページ数:

6

出版情報:

Zuerich-Uetikon, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499199 [0878499199]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013346
シリーズID:	PA00000012
会議名:	THERMEC : International Conference on Processing & Manufacturing of Advanced Materials
回次:	2003
会議開催地:	Leganés, Madrid, Spain
会議開催年:	2003.07.07-2003.07.11

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