Texture Analysis of Copper Bonding Wire

Texture Analysis of Copper Bonding Wire

著者名:

Baeck, S.M.

掲載資料名:

Textures of materials : ICOTOM 13 : proceedings of the 13th International Conference on Textures of Materials, Seoul, Korea, August 26-30, 2002

シリーズ名:

Materials science forum

シリーズ巻号:

408-412

発行年:

2002

開始ページ:

803

終了ページ:

808

総ページ数:

6

出版情報:

Uetikon-Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499038 [0878499032]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013338
シリーズID:	PA00000012
会議名:	International Conference on Textures of Materials - ICOTOM
回次:	13th
会議開催地:	Seoul, Korea
会議開催年:	2002.08.26-2002.08.30

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