Reactive Ion Etching Process of 4H-SiC Using the CHF3/O2 Mixtures and a Post-O2 Plasma-Etching Process

Reactive Ion Etching Process of 4H-SiC Using the CHF3/O2 Mixtures and a Post-O2 Plasma-Etching Process

著者名:

掲載資料名:

Silicon carbide and related materials 2001 : ICSCRM2001, proceedings of the International Conference on Silicon Carbide and Related Materials 2001, Tsukuba, Japan, October 28-November 2, 2001

シリーズ名:

Materials science forum

シリーズ巻号:

389-393

発行年:

2002

開始ページ:

949

終了ページ:

952

総ページ数:

4

出版情報:

Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878498949 [087849894X]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013331
シリーズID:	PA00000012
会議名:	International Conference on Silicon Carbide and Related Materials
回次:	2001
会議開催地:	Tsukuba, Japan
会議開催年:	2001.10.28-2001.11.02

類似資料:

1 国際会議録 Reactive Ion Etching Process of 4H-SiC Using the CHF3/O2 Mixtures and a Post-O2 Plasma-Etching Process Kang, S. C., Shin, M.W. Trans Tech Publications	7 国際会議録 Photoelectrochemical Etching Process of 6H-SiC Wafers Using HF-Based Solution and H2O2 Solution as Electrolytes Song, J.G., Shin, M.W. Trans Tech Publications
2 国際会議録 ANISOTROPIC AND SELECTIVE REACTIVE ION ETCHING OF SiC IN CHF3 AND OXYGEN PLASMA Pan, W-S., Steckl, A.J. Materials Research Society	8 国際会議録 Highly anisotropic etching of phase-shift masks using ICP of CF4-SF6-CHF3 gas mixtures Choi, S.-J., Cha, H.-S., Yoon, S.-Y., Kim, Y.-D., Lee, D.-H., Kim, J.-M., Kim, J.-S., Min, D.-S., Jang, P.-J., Chang, … SPIE-The International Society for Optical Engineering
3 国際会議録 Reactive Ion Etching of TiN, TiAlN, CrN and TiCN Films in CF4/O2 and CHF3/O2 Plasmas Leech, Patrick W., Reeves, G. K., Holland, A. S. Materials Research Society	9 国際会議録 CHF3 AND NH3 ADDITIVES FOR REACTIVE ION ETCHING OF GaAs USING CCl2F2 AND SiCl4 Din, Kuen-Sane, Chi, Guo-Chung Materials Research Society
4 国際会議録 EFFECTS OF POST ETCH TREATMENTS ON CONTAMINATED SILICON SURFACE DUE TO CHF3/C2F6 REACTIVE ION ETCHING Park, H.-H., Kwon, K.-H., Lee, S.-H., Nahm, S., Lee, J.-W., Koak, B.-H., Suh, K.-S., Kwon, O.-J., Lee, J.-L., Yeom, … MRS - Materials Research Society	10 国際会議録 Post Annealing Etch Process for Improved Reverse Characteristics of 4H-SiC Diode I.H. Kang, W. Bahng, S.J. Joo, S.C. Kim, N.K. Kim Trans Tech Publications
5 国際会議録 Photoelectrochemical Etching Process of 6H-SiC Wafers Using HF-Based Solution and H2O2 Solution as Electrolytes Song, J. G., Shin, M.W. Trans Tech Publications	11 国際会議録 CHARACTERISTICS AND RECOVERY OF Si SURFACES PLASMA ETCHING IN CHF3/C2F6 Park, H.-H., Kwon, K.H., Koak, B.-H., Lee, S.-M., Kwon, O-J., Kim, B.-W., Lee, J.-W., Yoo, J.-B., Sung, Y.-K. Materials Research Society
6 国際会議録 Mechanism of Reactive Ion Etching of 6H-SiC in CHF3/O2 Gas Mixtures Sieber,N., Ristein,J., Ley,L. Trans Tech Publications	12 国際会議録 Reactive ion beam etching of HfO2 film using Ar/CHF3 gas chemistries Wang, X., Xu, X., Liu, Y., Hong, Y., Fu, S. SPIE - The International Society of Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12