Microstructure and Thermal Stability of 'Nanocrystalline' Electrodeposited Au-Cu Alloys

Microstructure and Thermal Stability of 'Nanocrystalline' Electrodeposited Au-Cu Alloys

著者名:

掲載資料名:

Metastable, mechanically alloyed and nanocrystalline materials : ISMANAM 2000 : proceedings of the International Symposium on Metastable, Mecanically Alloyed and Nanocrystalline Materials, St. Catherine's College, Oxford, 9-14, July, 2000

シリーズ名:

Materials science forum

シリーズ巻号:

360-362

発行年:

2001

開始ページ:

253

終了ページ:

260

総ページ数:

8

出版情報:

Zurich-Uetikon, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878498659 [0878498656]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013317
シリーズID:	PA00000012
会議名:	ISMANAM : International Symposium on Metastable, Mecanically Alloyed and Nanocrystalline Materials
回次:	2000
会議開催地:	Oxford, UK
会議開催年:	2000.07.09-2000.07.14

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