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Three-Dimensional CAE of Wire-Sweep in Microchip Encapsulation

著者名:
Yang, W.H. ( CoreTech )
Hsu, D. ( CoreTech )
Yang, V. ( CoreTech )
Chang, R.Y. ( National Tsing-Hua University )
Su, F. ( ChipMOS )
Huang, S.J. ( National Chen Kung University )
Juang, S. ( National Chen Kung University )
さらに 2 件
掲載資料名:
ANTEC 2004, 62nd annual technical conference, Chicago, IL, May 16-20, 2004
シリーズ名:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
シリーズ巻号:
62
発行年:
2004
開始ページ:
1679
終了ページ:
1683
総ページ数:
5
出版情報:
Brookfield Center, Conn.: Society of Plastics Engineers
ISBN:
9780975370704 [0975370707]
言語:
英語
請求記号:
S42700/62-2
資料種別:
国際会議録

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