Blank Cover Image

Rapid Thermal Response (RTR) Hot Embossing of Micro-Structures

著者名:
掲載資料名:
ANTEC 2004, 62nd annual technical conference, Chicago, IL, May 16-20, 2004
シリーズ名:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
シリーズ巻号:
62
発行年:
2004
開始ページ:
933
終了ページ:
936
総ページ数:
4
出版情報:
Brookfield Center, Conn.: Society of Plastics Engineers
ISBN:
9780975370704 [0975370707]
言語:
英語
請求記号:
S42700/62-1
資料種別:
国際会議録

類似資料:

1 国際会議録 Rapid Thermal Response Molding for Cycle Time Reduction

Yao, D., Kim, B.H.

Society of Plastics Engineers
7 国際会議録 Long Wavelength Shifting and Broadening of Quantum Well Infrared Photodetector Response via Rapid Thermal Annealing

Sengupta, D. K., Fang, W., Malin, J. I., Kuo, H. C., Horton, T., Curtis, A., Gardner, N. F., Flachsbart, B., Wohlmuth, …

MRS - Materials Research Society
2 国際会議録 Simulation of Squeezing Flow during Hot Embossing of Polymer Microstructures

Virupaksha, V., Yao, D., Kim, B.

Society of Plastics Engineers
8 国際会議録 Hot-embossed polymeric optical waveguides (Invited Paper)

Choi, C. -G., Kim, J. -T., Han, S. -P., Ahn, S. -H.

SPIE - The International Society of Optical Engineering
3 国際会議録 Hot embossing and injection molding for micro-optical components

Heckele,M., Bacher,W., Hanemann,T., Ulrich,H.

SPIE-The International Society for Optical Engineering
9 国際会議録 Thin-Wall Injection Molding Using Rapidly Heated Molds

Yao, D., Kim, B.H.

Society of Plastics Engineers
4 国際会議録 Two-Material Injection Molding Filling Simulation

Liu, W., Kim, B., Yao, D.

Society of Plastics Engineers
10 国際会議録 RAPID THERMAL ANNEALED TiW/Ti CONTACT METALLIZATION FOR ADVANCED VLSI Si CIRCUITS

Chung, Henry W., Yao, Agnes T.

Materials Research Society
5 国際会議録 Development of Rapid Heating and Uniformly Pressing System for Micro Hot Embossing

Chang, J.H., Yang, S.Y.

Society of Plastics Engineers
11 国際会議録 RAPID THERMAL ANNEALED TiW/Ti CONTACT METALLIZATION FOR ADVANCED VLSI Si CIRCUITS

Chung, Henry W., Yao, Agnes T.

Materials Research Society
6 国際会議録 Micro hot embossing for high-aspect-ratio structure with materials flow enhancement by polymer sheet

Murakoshi, Y., Shan, X.-C., Sano, T., Takahashi, M., Maeda, R.

SPIE - The International Society of Optical Engineering
12 国際会議録 Simulation of filling characteristics during hot embossing of polymer microstructures

P. Jin, Y. Gao, T. Liu

Society of Photo-optical Instrumentation Engineers
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12