Numerical Simulation of Unserfill Cure Evolution in Chip-Scale-Package (CSP) Manufacturing Process

Numerical Simulation of Unserfill Cure Evolution in Chip-Scale-Package (CSP) Manufacturing Process

著者名:

Gomatam, Rajesh R. ( Lehigh University )
Coulter, John P.

掲載資料名:

Proceedings, 2003 International Symposium on Microelectronics, November 18-20, 2003, Hynes Convention Center, Boston, Massa Massachusetts, USA

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

5288

発行年:

2003

開始ページ:

916

終了ページ:

921

総ページ数:

6

出版情報:

Reston, Va.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819451897 [0819451894]

言語:

英語

請求記号:

P63600/5288

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013172
シリーズID:	PA00000029
会議名:	International Symposium on Microelectronics
回次:	2003
会議開催地:	Boston, MA, USA
会議開催年:	2003.11.18-2003.11.20

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