Using OPC to optimize for image slope and improve process window

Using OPC to optimize for image slope and improve process window

著者名:

Cobb, N.B. ( Mentor Graphics Corp. (USA) )
Granik, Y. ( Mentor Graphics Corp. (USA) )

掲載資料名:

Photomask and Next-Generation Lithography Mask Technology X

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

5130

発行年:

2003

開始ページ:

838

終了ページ:

846

総ページ数:

9

出版情報:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819449962 [0819449962]

言語:

英語

請求記号:

P63600/5130

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013118
シリーズID:	PA00000029
会議名:	Photomask and next-generation lithography mask technology
回次:	2003 : 10th
会議開催地:	Yokohama, Japan
会議開催年:	2003.04.16-2003.04.18

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6 国際会議録 Failure prediction across process window for robust OPC Shang, S.D., Granik, Y., Cobb, N.B., Maurer, W., Cui, Y., Liebmann, L.W., Oberschmidt, J.M., Singh, R.N., Vampatella, … SPIE-The International Society for Optical Engineering	12 国際会議録 Subresolution process windows and yield estimation technique based on detailed full-chip CD simulation Granik,Yu., Cobb,N.B., Sahouria,E.Y., Toublan,O., Capodieci,L., Socha,R.J. SPIE-The International Society for Optical Engineering

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