Thermal profiling for IC chip high-voltage stress prediction

Thermal profiling for IC chip high-voltage stress prediction

著者名:

Hsieh, S.-J. ( Texas A&M Univ. (USA) )
Huang, S.-L. ( Texas A&M Univ. (USA) )

掲載資料名:

Thermosense XXV, 22-24 April, 2003, Orlando, Florida, USA

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

5073

発行年:

2003

開始ページ:

264

終了ページ:

276

総ページ数:

13

出版情報:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819449320 [0819449326]

言語:

英語

請求記号:

P63600/5073

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00013061
シリーズID:	PA00000029
会議名:	Defense, Security, and Sensing : Thermosense
回次:	2003 : 25th
会議開催地:	Orlando, FL, USA
会議開催年:	2003.04.22-2003.04.24

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