Flip-Chip Packaging Solution for CMOS Image Sensor Device

Flip-Chip Packaging Solution for CMOS Image Sensor Device

著者名:

Kim, Jong-Heon ( C-Cube Digital Corp., Ltd. )

Seo, Tae-Jun ( Samsung Electro-Mechanics )

さらに 1 件

掲載資料名:

Proceedings : 2002 International Symposium on Microelectronics : September 4-6, 2002, Colorado Convention Center, Denver, CO

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

4931

発行年:

2002

開始ページ:

738

終了ページ:

743

総ページ数:

6

出版情報:

Washington, DC: IMAPS

ISSN:

0277786X

ISBN:

9780930815660 [0930815661]

言語:

英語

請求記号:

P63600/4931

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00012780
シリーズID:	PA00000029
会議名:	International Symposium on Microelectronics
回次:	2002
会議開催地:	Denver, CO, USA
会議開催年:	2002.09.04-2002.09.06

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