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Technical Challenges of Stencil Printing Technology for Ultra Fine Pitch Flip Chip Bumping

著者名:
Manessis, Dionysios ( Technical University of Berlin )
Patzelt, Rainer
Nieland, Sabine
Ostmann, Andreas ( Fraunhofer Institute for Reliability and Microintegration - IZM )
Aschenbrenner, Rolf
Reichi, Herbert
さらに 1 件
掲載資料名:
Proceedings : 2002 International Symposium on Microelectronics : September 4-6, 2002, Colorado Convention Center, Denver, CO
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
4931
発行年:
2002
開始ページ:
727
終了ページ:
732
総ページ数:
6
出版情報:
Washington, DC: IMAPS
ISSN:
0277786X
ISBN:
9780930815660 [0930815661]
言語:
英語
請求記号:
P63600/4931
資料種別:
国際会議録

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