Packaging solutions for MEMS/MOEMS using thin films as mechanical components

Packaging solutions for MEMS/MOEMS using thin films as mechanical components

著者名:

Boyle, P. ( Cambridge Univ. (UK) )
Syms, R.R.A. ( Imperial College of Science, Technology and Medicine (UK) )
Moore, D.F. ( Cambridge Univ. (UK) )

掲載資料名:

Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

4755

発行年:

2002

開始ページ:

496

終了ページ:

507

総ページ数:

12

出版情報:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819445186 [0819445185]

言語:

英語

請求記号:

P63600/4755

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00012592
シリーズID:	PA00000029
会議名:	Design, test, integration, and packaging of MEMS/MOEMS
回次:	2002
会議開催地:	Cannes, France
会議開催年:	2002.05.06-2002.05.08

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