Characterization of electronic packaging materials and components by image correlation methods

Characterization of electronic packaging materials and components by image correlation methods

著者名:

Vogel, D. ( Fraunhofer-Institut fuer Zuverlaessigkeit und Mikrointegration (Germany) )
Auersperg, J.
Michel, B.

掲載資料名:

Advanced photonic sensors and applications II : 27-30 November 2001, Singapore

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

4596

発行年:

2001

開始ページ:

237

終了ページ:

247

総ページ数:

11

出版情報:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819443267 [0819443263]

言語:

英語

請求記号:

P63600/4596

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00012424
シリーズID:	PA00000029
会議名:	International Symposium on Photonics and Applications : Advanced photonic sensors and applications
回次:	2001 : 2nd
会議開催地:	Singapore
会議開催年:	2001.11.27-2001.11.30

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