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Silicon Carbide Power Die Packaging in Diamond Substrate Multichip Power Module Applications

著者名:
掲載資料名:
Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
4587
発行年:
2001
開始ページ:
389
終了ページ:
393
総ページ数:
5
出版情報:
Washington, DC: IMAPS
ISSN:
0277786X
ISBN:
9780930815646 [0930815645]
言語:
英語
請求記号:
P63600/4587
資料種別:
国際会議録

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