New Tools and Methods for the Thermal Transient Testing of Packages
- 著者名:
- Rencz,Marta ( Micred Ltd )
- Farkas,G.
- Szekely,Vladimir
- Poppe,A.
- Courtois,Bernard
- 掲載資料名:
- Proceedings : 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California
- シリーズ名:
- Proceedings of SPIE - the International Society for Optical Engineering
- シリーズ巻号:
- 4428
- 発行年:
- 2001
- 開始ページ:
- 268
- 終了ページ:
- 273
- 総ページ数:
- 6
- 出版情報:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780930815639 [0930815637]
- 言語:
- 英語
- 請求記号:
- P63600/4428
- 資料種別:
- 国際会議録
類似資料:
Kluwer Academic Publishers | |
SPIE - The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |