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Method of localized and low-temperature wafer bonding for microsystem packaging

著者名:
掲載資料名:
MEMS design, fabrication, characterization, and packaging : 30 May-1 June 2001, Edinburgh, UK
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
4407
発行年:
2001
開始ページ:
185
終了ページ:
192
総ページ数:
8
出版情報:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819441089 [0819441082]
言語:
英語
請求記号:
P63600/4407
資料種別:
国際会議録

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