A Micromachined Ball Grid Array Test Socket for Fine-Pitch Interconnect

A Micromachined Ball Grid Array Test Socket for Fine-Pitch Interconnect

著者名:

Huang,B. ( University of Arkansas/HiDEC )

掲載資料名:

Proceedings : 2000 International Symposium on Microelectronics, September 20-22, 2000, Hynes Convention Center, Boston, Massachusetts

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

4339

発行年:

2000

開始ページ:

172

終了ページ:

177

総ページ数:

6

出版情報:

Reston, VA: IMAPS

ISSN:

0277786X

ISBN:

9780930815622 [0930815629]

言語:

英語

請求記号:

P63600/4339

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00012055
シリーズID:	PA00000029
会議名:	International Symposium on Microelectronics
回次:	2000
会議開催地:	Boston, MA, USA
会議開催年:	2000.09.20-2000.09.22

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